Teledyne DALSA has introduced a new multispectral Camera Link HS line scan camera, which is part of the company’s Linea product line. Through spectrally independent outputs of the RGB and NIR channels, the Linea ML 8k multispectral camera detects defects both on and under the surface of materials, components, and products without spectral interference. This capability makes the camera suited to complex applications such as those involving semiconductor wafers, printed circuit boards, banknotes, and passports, the company says. The Linea ML 8k multispectral camera uses Teledyne DALSA’s CMOS 8k quad linear sensor with a 5- x 5-μm pixel size and delivers a maximum line rate of 70 kHz x 4 using a CLHS fiberoptic interface. The camera also has built-in SFP+ transceivers that convert electrical signals to optical signals, and it connects directly to fiberoptic cables up to 300 m using LC connectors. The camera is compatible with the Teledyne DALSA Xtium™2 CLHS series of frame grabbers.
To Learn More:
Contact: Teledyne DALSA
Headquarters: Waterloo, Canada
Product: Linea ML 8k multispectral camera
Key Features: Spectrally independent RGB and NIR outputs for detection of defects without spectral interference, built-in SFP+ transceivers that convert electrical signals to optical signals, Direct connection to fiberoptic cables up to 300 m
What Teledyne DALSA says:
View more information on Linea ML 8k multispectral camera.
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